A. Lewis et al., Failure analysis of integrated circuits beyond the diffraction limit: Contact mode near-field scanning optical microscopy with integrated resistance,capacitance, and UV confocal imaging, P IEEE, 88(9), 2000, pp. 1471-1479
Superresolution reflection near-field scanning optical microscopy (NSOM) of
ultra-large-scale integrated circuits (ULSI) that have been subjected to c
hemical mechanical polishing (CMP) ave presented These NSOM images are rich
in contrast, unlike simultaneously recorded atomic force microscopy (AFM)
images. The NSOM data are compared to reflection confocal far-field optical
microscopy using ultraviolet radiation with a wavelength of 248 nm which h
as a resolution close to 0.2 mum. Evert though there is a significant thick
ness of oxide between the tip and the layer being imaged, the data recorded
with visible light clearly exhibits higher resolution than those ultraviol
et confocal images that have undergone computer deconvolution. The AFM imag
es exhibit no topography representing circuit features because the CMP oper
ation that these static random access memory chips (SRAMs) have been subjec
ted to produces flat topographic free surfaces. In terms of NSOM imaging, t
his is most interesting since the contribution of topography is totally rem
oved and index of refraction variations ave the only source for these rich
NSOM images. Clearly, these NSOM images with cantilevered NSOM elements are
free from topographic artifacts. Furthermore, simultaneous imaging of NSOM
, normal force topography, and functional electrical characteristics such a
s capacitance and resistance are presented on these SRAMs. This demonstrate
s the ability of NSOM to act as a tool that provocatively integrates the be
st of far-field, optical imaging on the one hand with the most advanced sca
nned probe electrical imaging of circuit function on the other.