Development and validation of lead-free wave soldering process

Though lead-free replacements for SnPb eutectic alloys for reflow, wave, an d hand soldering have been developed, relatively little has been reported o n practical ex perjence of lead-free wave soldering processes. In wave sold ering, the interaction between the PCB, flux, solder alloy and processing e quipment makos it desirable to develop the consumables and the wave solderi ng machine concurrently. A crossfunctional project team was formed and a le ad-free wave soldering process developed and validated through nine months of industrial use in production of broad-band communications technology pro ducts.