Causes and effects of corrosion in plastic IC packages

Authors
Citation
A. Hawes et T. Adams, Causes and effects of corrosion in plastic IC packages, ELECTRO ENG, 72(886), 2000, pp. S97
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
ELECTRONIC ENGINEERING
ISSN journal
00134902 → ACNP
Volume
72
Issue
886
Year of publication
2000
Database
ISI
SICI code
0013-4902(200011)72:886<S97:CAEOCI>2.0.ZU;2-5
Abstract
As package sizes are reduced the barrier to the ingress of materials that c an cause corrosion are also reduced. This feature offers a unique perspecti ve on the problems of corrosion when the special requirements of the milita ry (US Navy) systems are part of the long term reliability equation. The ph ysical view of the problem is provided by means of acoustic imaging, As pac kages continue to shrink, with boards and packages converging the potential for the effects of corrosion remain an important consideration for designe rs at all levels.