As both RF operating frequencies and digital clock rates continue to rise,
package, board and connector designers will need to co-operate in order to
meet the performance requirements demanded by system designers. The sub-dis
cipline demarcation questions of the past- Is it a package? Is it a board?
Is it a connector? will surely disappear. Here a new microwave package vert
ical connection technique is described, with simulation and measured result
s.