The reaction between shape-memory TiNi thin films and silicon has been
characterized by conventional, analytical, and high-resolution transm
ission electron microscopy. A reaction layer is formed during the 525
degrees C post-deposition crystallization anneal of the sputter-deposi
ted TiNi, and consists of several phases: Ti2Ni, a nickel silicide, an
d a ternary titanium nickel silicide. The mechanism for the interlayer
formation is discussed.