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ENG
Minimization of diffuse scattering reduces resistivity of thin copper films
Authors
Lind, C
Citation
C. Lind, Minimization of diffuse scattering reduces resistivity of thin copper films, MRS BULL, 25(9), 2000, pp. 7-7
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MRS BULLETIN
ISSN journal
08837694 →
ACNP
Volume
25
Issue
9
Year of publication
2000
Pages
7 - 7
Database
ISI
SICI code
0883-7694(200009)25:9<7:MODSRR>2.0.ZU;2-I