Molecular dynamics simulation of the role of dislocations in microcrack healing

The molecular dynamics method is used to simulate microcrack healing during heating or/and under compressive stress. A centre microcrack in Cu crystal would be sealed under compressive stress or by heating. The role of compre ssive stress and heating in crack healing was additive. During microcrack h ealing, dislocation generation and motion occurred. When there were pre-exi sting dislocations around the microcrack, the critical temperature or compr essive stress necessary for microcrack healing would decrease, and, the hig her the number of dislocations, the lower the critical temperature or compr essive stress. The critical temperature necessary for microcrack healing de pended upon the orientation of the crack plane. For example, the critical t emperature for the crack along the (001) plane was the lowest, i.e. 770K.