State-of-the-art lithographic techniques are able to fabricate structures f
or the semiconductor and other nanofabrication industries with dimensions b
elow 150 nm. The relentless drive to further miniaturize semiconductor devi
ces has placed increasingly stringent demands on current microscopy-based t
echniques for precisely measuring the size and the quality (line-edge rough
ness) of lithographically produced features. Using newly developed neutron
optics, we demonstrate the first application of small-angle neutron scatter
ing to nondestructively and quantitatively measure both the dimension and t
he quality of 150 nm lines fabricated on single crystal silicon wafers. (C)
2000 American Institute of Physics. [S0021-8979(00)07524-1].