New thermosetting resin from poly(p-vinylphenol) based benzoxazine and epoxy resin

Poly(p-vinylphenol) (VP) based benzoxazine was prepared from VP, formaline, and aniline. The curing behavior of the benzoxazine with the epoxy resin a nd the properties of the cured resin were investigated. Consequently, the c uring reaction did not proceed at low temperatures, but it proceeded rapidl y at higher temperatures without a curing accelerator. The reaction inducti on time or cure time of the molten mixture from VP based benzoxazine and ep oxy resin was found to decrease, compared with those from conventional bisp henol A based benzoxazine and epoxy resin. The curing reaction rate of VP b ased benzoxazine and epoxy resin increased more than that of conventional b isphenol A based benzoxazine and epoxy resin. The properties of the cured r esin from neat resins and from reinforced resins with fused silica were eva luated. The cured resins from VP based benzoxazine and epoxy resin showed g ood heat resistance, mechanical properties, electrical insulation, and wate r resistance compared to the cured resin from VP and epoxy resin using imid azole as the catalyst. (C) 2000 John Wiley & Sons, Inc.