Fracture of Sn-3.5%Ag solder alloy under creep

Authors
Igoshev, VI Kleiman, JI Shangguan, D Wong, S Michon, U
Citation
Vi. Igoshev et al., Fracture of Sn-3.5%Ag solder alloy under creep, J ELEC MAT, 29(12), 2000, pp. 1356-1361
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF ELECTRONIC MATERIALS
ISSN journal
03615235 → ACNP
Volume
29
Issue
12
Year of publication
2000
Pages
1356 - 1361
Database
ISI
SICI code
0361-5235(200012)29:12<1356:FOSSAU>2.0.ZU;2-R
Abstract
Experimental data on the creep and failure of the Sn-3.0%Ag, Sn-3.5%Ag, and Sn-4.0%Ag lead free solder alloys are described. Further development of th e alloys' failure micromechanism, proposed earlier, is presented. Possible ways of improving the mechanical properties of Sn-Ag-based solder alloys ar e discussed.