Experimental study on the performance of a compact heat sink for LSI packages

Citation
M. Ishizuka et al., Experimental study on the performance of a compact heat sink for LSI packages, P I MEC E A, 214(A5), 2000, pp. 523-530
Citations number
14
Categorie Soggetti
Mechanical Engineering
Journal title
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART A-JOURNAL OF POWER AND ENERGY
ISSN journal
09576509 → ACNP
Volume
214
Issue
A5
Year of publication
2000
Pages
523 - 530
Database
ISI
SICI code
0957-6509(2000)214:A5<523:ESOTPO>2.0.ZU;2-9
Abstract
The cooling performance of compact heat sinks composed of small fins, inves tigated in conditions of both natural and forced air convection, should als o be explored in designing the heat sink on an LSI package. An experimental study was performed with respect to natural air convection and forced air convection. Several kinds of compact heat sink which have different base ar eas, fin intervals and fin heights were heated by an attached electrical he ater, which could supply a specific heat flux. The increase in fin temperat ure was measured by small thermocouples. In natural air convection experime nts, the effect of the supplied wattage on the temperature rise of the heat sink was examined for different fin intervals and fin heights. In forced a ir convection experiments, a wind tunnel was used. The heat sink was set do wnstream in the wind tunnel and a specific heat flux was applied to it. The correlation between supplied air velocity and temperature rise in the heat sinks was explored. Furthermore, from these results, non-dimensional expre ssions to evaluate the cooling performance of compact heat sinks were exami ned.