Efficient, high-throughput post-STI CMP cleaning

A new high-productivity scrubber system provides precise cotrol of chemical mixing and delivery. It enables using a single cleaning solution for the r emoval of all types of chemical mechanical polishing defects, Philips Semic onductor has successfully applied this system in production for post-STI MP cleaning. The new process removes slurry minimizes etch enlargement of STI CMP microscratches, and significantly higher throughput and lower cost of ownership to conventional scrubber systems.