Reduction of perfluorocompound emissions is a committed goal of the semicon
ductor industry. The majority of PFC usage is for CVD chambers. Three strat
egies for reducing the emissions are presented here: 1) optimization of tra
ditional C-2,F-6-based in situ cleans, 2) substitution of NF3 for C2F6 in i
n situ cleans, and 3) remote NF, cleaning. The improvements are demonstrate
d on equipment from major manofacturers of CVD tools.