Sb. Wang et al., Preferential growth of C54TiSi(2) by metal vapor vacuum arc ion source implantation and post-annealing, SURF COAT, 131(1-3), 2000, pp. 84-87
Both [100] and [111] oriented Si wafers (n-type) were implanted with 45-keV
Ti ions to a dose of 4 x 10(17) ions/cm(2). X-Ray diffraction (XRD) patter
ns show that there are different initial silicides, such as: C54 TiSi2, C49
TiSi2 and Ti5Si3. It is interesting that the initial phases are beam curre
nt and substrate dependent. When annealing was performed at higher temperat
ure, both the C49 TiSi2 and Ti5Si3 transform into C54 TiSi2. Moreover, C54
TiSi2 was grown with various preferential orientations on different substra
tes in annealing processes. Rutherford backscattering spectrometry (RBS) re
sults show that the Ti atomic profile has little change through annealing.
In addition, sheet resistance measurements also reflect that the synthesize
d disilicide is excellent in electrical conductivity. This suggests that th
e method has potential for realizing electrical contact in very large-scale
integrated (VLSI) circuits. (C) 2000 Published by Elsevier Science B.V. Al
l rights reserved.