High current metal-ion implantation to fabricate metal silicides

Authors
Citation
Hn. Zhu et Bx. Liu, High current metal-ion implantation to fabricate metal silicides, SURF COAT, 131(1-3), 2000, pp. 307-316
Citations number
20
Categorie Soggetti
Material Science & Engineering
Journal title
SURFACE & COATINGS TECHNOLOGY
ISSN journal
02578972 → ACNP
Volume
131
Issue
1-3
Year of publication
2000
Pages
307 - 316
Database
ISI
SICI code
0257-8972(20000901)131:1-3<307:HCMITF>2.0.ZU;2-D
Abstract
Using a metal vapor vacuum are (MEVVA) ion source, metallic silicides, such as C54-TiSi2, NiSi2, COSi2, NbSi2 and TaSi2, etc., with good electrical pr operties were obtained directly on Si wafers by high current metal-ion impl antation with neither in situ heating nor post-annealing. Semiconducting si licides, such as beta -FeSi2 and CrSi2, were also directly formed on Si waf ers by MEVVA ion implantation with unique physical properties. The growth m echanism of the metal silicides is also discussed for Ni-Si as a representa tive system. (C) 2000 Elsevier Science B.V. All rights reserved.