Total-energy pseudopotential calculations are used to study the cleavage fr
acture processes in silicon. It is shown that bonds break continuously and
cracks propagate easily on {111} and {110} planes provided crack propagatio
n proceeds in the (110) direction. In contrast, if the crack is driven in a
(001) direction on a {110} plane the bond breaking process is discontinuou
s and associated with pronounced relaxations of the surrounding atoms. The
discontinuous process is partly a result of some load sharing between the c
rack tip bond and the neighbouring bond, which results in a large lattice t
rapping. The different lattice trapping for different crack propagation dir
ections can explain the experimentally observed cleavage anisotropy in sili
con single crystals. (C) 2000 Acta Metallurgica Inc. Published by Elsevier
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