Deposition of electroceramic thin films by MOCVD

Citation
J. Lindner et al., Deposition of electroceramic thin films by MOCVD, ADV MAT OPT, 10(3-5), 2000, pp. 163-167
Citations number
15
Categorie Soggetti
Material Science & Engineering
Journal title
ADVANCED MATERIALS FOR OPTICS AND ELECTRONICS
ISSN journal
10579257 → ACNP
Volume
10
Issue
3-5
Year of publication
2000
Pages
163 - 167
Database
ISI
SICI code
1057-9257(200005/10)10:3-5<163:DOETFB>2.0.ZU;2-M
Abstract
MOCVD (metal-organic chemical vapor deposition) of new materials, such as p erovskite-type ceramic thin films, will be a major key technology in the fi eld of ULSI non-volatile and volatile memory applications. This article out lines the latest trends in the field of MOCVD equipment and process develop ment, in particular In the field of high k-dielectric and ferroelectrics, U sing liquid precursor delivery systems reproducible evaporation can be achi eved, Furthermore, perfect temperature control, as well as a precise gas an d vapor flow control through the gas inlet to the substrate, ensure high qu ality BST, PZT and SET thin films, bearing superior electrical and microstr uctural properties and near 100% step coverage at low process temperatures. Copyright (C) 2000 John Wiley & Sons, Ltd.