An optimum spacing problem for four chips on a horizontal substrate - mixed convection

The optimum spacing problem for four heated chips rested on a conductive su bstrate in a channel is solved by an operator-splitting pseudo-time-steppin g finite dement method, which automatically satisfies the continuity of the interfacial temperature and heat flux. It is found that the conventional e qui-spaced arrangement is not an optimum option for mixed convection situat ion. An optimum thermal performance can be obtained when the center-to-cent er distances between the chips follow a geometric series. When the ratio is larger than 1.2, the maximum temperature and the maximum temperature diffe rence can be decreased significantly compared to the ratio of 1.0.