Hot carrier reliability improvement by utilizing phosphorus transient enhanced diffusion for input/output devices of deep submicron CMOS technology

Citation
Hch. Wang et al., Hot carrier reliability improvement by utilizing phosphorus transient enhanced diffusion for input/output devices of deep submicron CMOS technology, IEEE ELEC D, 21(12), 2000, pp. 598-600
Citations number
7
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE ELECTRON DEVICE LETTERS
ISSN journal
07413106 → ACNP
Volume
21
Issue
12
Year of publication
2000
Pages
598 - 600
Database
ISI
SICI code
0741-3106(200012)21:12<598:HCRIBU>2.0.ZU;2-L
Abstract
This letter presents a deep submicron CMOS process that takes advantage of phosphorus transient enhanced diffusion (TED) to improve the hot carrier re liability of 3.3 V input/output transistors, Arsenic/phosphorus LDI) nMOSFE Ts with and without TED are fabricated. The TED effects on a LDD junction p rofile, device substrate current and transconductance degradation are evalu ated, Substantial substrate current reduction and hot carrier lifetime impr ovement for the input/output devices are attained due to a more graded n(-) LDD doping profile by taking advantage of phosphorus TED.