A simple processing technique has been developed for joining Si3N4,-based c
eramics. Thin (<5 <mu>m thick), amorphous, or partially crystalline SiO2-ba
sed surface layers were formed, via low-temperature oxidation (at 1200 degr
eesC), on the faces to be joined. Joining of the surface-coated pieces coul
d then be performed in an inert environment at typical sintering/joining te
mperatures (i,e., 1700 degreesC), with or without applied gas pressure, via
a transient viscous/liquid phase. This method was most effective for Si3N4
ceramics with single oxide sintering additives when a thin (similar to1 mu
m thick), highly smooth (RMS roughness <60 nm) SiO2 layer was formed, and e
ssentially 'pore-free' joints could be formed. However, the method was less
suitable for a multi additive SiAlON material under current experimental c
onditions, as relatively high roughness (RMS roughness >400 nm) oxide scale
s formed, leaving residual porosity at the joint interface.