The fabrication in a standard CMOS line of a light emitting diode (LED) bas
ed on silicon/porous silicon heterojunction is discussed. To fabricate the
LED in a CMOS line, the porous silicon formation must br performed either a
s the last or as an intermediate step. The former option requires a masking
layer to protect the metallization level of the CMOS devices from the elec
trochemical solution for the pc,rous silicon formation, whereas the latter
forces an interruption in the process. Experimental tests on several materi
als, routinely used in CMOS processes, show that no standard mask is suitab
le Lo fully protect the CMOS Boom the electrochemical etch. Hence porous si
licon formation should br performed as an intermediate step.