Solder thickness variation with respect to soldering parameters

This study investigated the growth behavior of solder interconnect on solde r bonding pad. The solder thickness was investigated with respect to parame ters including bonding pad area, reflow temperature, solder paste volume, l oading, and die size (metallization area). Solder thickness was found to ha ve a maximum value with respect to the ratio of solder paste volume to pad size. Loading and the reflow temperature showed no effect on solder thickne ss. An enlargement in metallization area reduces the solder thickness, whil e greater solder paste volume increases the solder thickness.