Void growth and coalescence in metals deformed at elevated temperature

Citation
H. Klocker et V. Tvergaard, Void growth and coalescence in metals deformed at elevated temperature, INT J FRACT, 106(3), 2000, pp. 259-276
Citations number
16
Categorie Soggetti
Mechanical Engineering
Journal title
INTERNATIONAL JOURNAL OF FRACTURE
ISSN journal
03769429 → ACNP
Volume
106
Issue
3
Year of publication
2000
Pages
259 - 276
Database
ISI
SICI code
0376-9429(200012)106:3<259:VGACIM>2.0.ZU;2-R
Abstract
For metals deformed at elevated temperatures the growth of voids to coalesc ence is studied numerically. The voids are assumed to be present from the b eginning of deformation, and the rate of deformation considered is so high that void growth is dominated by power law creep of the material, without a ny noticeable effect of surface diffusion. Axisymmetric unit cell model com putations are used to study void growth in a material containing a periodic array of voids, and the onset of the coalescence process is defined as the stage where plastic flow localizes in the ligaments between neighbouring v oids. The focus of the study is on various relatively high stress triaxiali ties. In order to represent the results in terms of a porous ductile materi al model a set of constitutive relations are used, which have been proposed for void growth in a material undergoing power law creep.