The effect of Cu and Au on field aided lateral crystallization (FALC) proce
ss of amorphous silicon films was investigated. Although both Cu and Au ind
uced the crystallization of a-Si in contact with those metals, only Cu was
able to induce the lateral crystallization toward a metal-free region. Espe
cially, the crystallization caused by Cu atoms was noticeably accelerated a
t the edge near the negative electrode side in every pattern under the elec
tric field, while the lateral crystallization was retarded at the positive
electrode side. The crystallization velocity increased with the applied fie
ld intensity and the annealing temperature, but it decreased with the size
of test pattern. However, electric field did not affect the crystallization
by Au. The maximum crystallization velocity using Cu was 770 mum/h at 500
degreesC in the electric field of 4V/cm and the lateral crystallization was
achieved at a temperature as low as 450 degreesC.