Atomistic simulation of stacking fault tetrahedra formation in Cu

Citation
Bd. Wirth et al., Atomistic simulation of stacking fault tetrahedra formation in Cu, J NUCL MAT, 283, 2000, pp. 773-777
Citations number
21
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Nuclear Emgineering
Journal title
JOURNAL OF NUCLEAR MATERIALS
ISSN journal
00223115 → ACNP
Volume
283
Year of publication
2000
Part
B
Pages
773 - 777
Database
ISI
SICI code
0022-3115(200012)283:<773:ASOSFT>2.0.ZU;2-3
Abstract
Atomistic simulations based on the embedded atom method (EAM) are used to m odel the formation of stacking fault tetrahedra (SFT) in face centered cubi c (fcc) Cu. SFTs are observed in fee metals following both irradiation and plastic deformation and have significant impact on defect accumulation and microstructural evolution of the irradiated material. Many authors have pro posed SFT formation mechanisms; :however, a concise atomistic view is lacki ng. Starting from the vacancy-rich regions produced in high-energy displace ment cascades, we have performed molecular dynamics (MD) simulations at a r ange of temperatures and observed SFT formation. In this work, we provide a n atomistic picture of SFT formation. (C) 2000 Elsevier Science B.V. All ri ghts reserved.