Numerical analysis of SOI LDMOS using a recessed source and a trench drain

Citation
Sj. Yoo et al., Numerical analysis of SOI LDMOS using a recessed source and a trench drain, MICROELEC J, 31(11-12), 2000, pp. 963-967
Citations number
4
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS JOURNAL
ISSN journal
00262692 → ACNP
Volume
31
Issue
11-12
Year of publication
2000
Pages
963 - 967
Database
ISI
SICI code
0026-2692(200011/12)31:11-12<963:NAOSLU>2.0.ZU;2-H
Abstract
A new SOI LDMOS using a recessed source and a trench drain was proposed to improve the on-characteristics at a given breakdown voltage. On-resistance and breakdown voltages of the proposed LDMOS are investigated by the two-di mensional simulator, MEDICI. The simulation results show that the on-resist ance of the proposed and the conventional LDMOS are 76.3 and 129.5 m Ohm mm (2), respectively. The on-resistance of the proposed LDMOS decreases by 41% compared to that of the conventional LDMOS at the same breakdown voltage o f 36.5 V. (C) 2000 Published by Elsevier Science Ltd.