Effect of various processing variables on grain alignment at Bi-2212/Ag interface

Authors
Rikel, MO Reeves, JL Scarbrough, NA Hellstrom, EE
Citation
Mo. Rikel et al., Effect of various processing variables on grain alignment at Bi-2212/Ag interface, PHYSICA C, 341, 2000, pp. 2573-2574
Citations number
3
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
PHYSICA C
ISSN journal
09214534 → ACNP
Volume
341
Year of publication
2000
Part
4
Pages
2573 - 2574
Database
ISI
SICI code
0921-4534(200011)341:<2573:EOVPVO>2.0.ZU;2-T
Abstract
The effect of conductor geometry, maximum melt-processing temperature, Bi2S r2CaCu2Ox (2212) composition, and preannealing and intermediate rolling on grain alignment at the 2212/Ag interface was studied using scanning electro n microscopy (SEM) and X-ray diffraction (XRD).