Effect of PAIR process on microstructure of Ag-sheathed Bi-2212 tapes

Authors
Reeves, J Adolphs, D Arndt, A Zwicky, D Rikel, M Hellstrom, E
Citation
J. Reeves et al., Effect of PAIR process on microstructure of Ag-sheathed Bi-2212 tapes, PHYSICA C, 341, 2000, pp. 2021-2022
Citations number
4
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
PHYSICA C
ISSN journal
09214534 → ACNP
Volume
341
Year of publication
2000
Part
3
Pages
2021 - 2022
Database
ISI
SICI code
0921-4534(200011)341:<2021:EOPPOM>2.0.ZU;2-X
Abstract
In this study, we have applied the Pre-Anneal and Intermediate Rolling (PAI R) process to Ag-sheathed mono-core Bi-2212 tapes. Initial results show tha t increasing the percent reduction decreased the amount of 14:24 AEC and Cu -free particles while increasing the amount of the Bi-2201 phase. However, grain alignment was adversely affected by sausaging in tapes with the highe st percent reduction.