Preparation and properties of rigid-rod polyimide/silica hybrid materials by sol-gel process

Polyimide (PI) materials with a low coefficient of thermal expansion (CTE) while still retaining high strength and toughness are desirable in various applications. In this study a sol-gel process was used to incorporate silic a into homopolyimides and copolyimides with highly rigid structures in an a ttempt to pursue this aim. a number of highly rigid monomers were used, inc luding pyromellitic dianhydride (PMDA), p-phenylene diamine (PPA), m-phenyl ene diamine (MPA), benzidine, 2,4-diaminotoluene, and o-toluidine. No homop olyimide flexible films were obtained. However, it was possible to obtain f lexible films from the copolyimides. Therefore, a copolyimide based on PPA, MPA, and PMDA (PPA/MPA = 2/1 mol) was then chosen as the matrix to prepare the PI/silica hybrids. Flexible films were obtained when the silica conten t was below 40 wt %. The hybrid films possessed low in-plane CTEs ranging f rom 14.9 to 31.1 ppm with the decrease of the silica content. The copolyimi de film was strengthened and toughened with the introduction of an appropri ate amount of silica. The thermal stability and the Young's modulus of the hybrid films increased with the increase of the silica content. The silica particle size was assessed by scanning electron microscopy and was about 10 0 nm for the hybrids containing 10 and 20 wt % silica and 200-500 nm for th e hybrids containing 30 and 40 wt % silica. (C) 2000 John Wiley & Sons, Inc .