In older to introduce next generation lithography (NGL) into practical use,
developing a production-worthy exposure tool is as important as developing
a proof-of-concept system and mask technology. The progress of the exposur
e tool can be used as a measure of the status of each NGL choice. Canon has
been focusing on the development of a proximity x-ray lithography (PXL) sy
stem for volume production use since the start of development. This has inc
luded development of magnification correction, development of a high-seed w
afer stage, improvement of illumination intensity, extension of process lat
itude in the alignment system design, and development of an accurate enviro
nment control system. For example, we introduced a new method, using mechan
ical deformation of the mask, for magnification correction. We also develop
ed a new wafer stage based on a field proven-high-speed wafer stage from ou
r current optical lithography systems. A stepping time (including settling
time) of less than 400 ms for a 50 mm step in a low-pressure helium environ
ment was achieved. These achievements have been integrated into our volume
production tool: the XRA-1000 x-ray stepper. The XRA-1000 has been installe
d in ASET and it will be used as the means for other process module develop
ment. Its results will demonstrate that PXL technology is the most practica
l NGL technology for volume production. (C) 2000 American? Vacuum Society.
[S0734-211X(00)16206-7].