Novel alignment system for imprint lithography

Citation
Dl. White et Or. Wood, Novel alignment system for imprint lithography, J VAC SCI B, 18(6), 2000, pp. 3552-3556
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
ISSN journal
10711023 → ACNP
Volume
18
Issue
6
Year of publication
2000
Pages
3552 - 3556
Database
ISI
SICI code
1071-1023(200011/12)18:6<3552:NASFIL>2.0.ZU;2-8
Abstract
A novel alignment system for imprint lithography in the deep sub-hundred na nometer realm is proposed. The new system is inherently more precise than t he alignment systems used in conventional projection lithography because al ignment marks on an imprint mold (the functional equivalent of a photomask in projection lithography) are directly compared to alignment marks on a wa fer with no intermediate optics or reference points. If the measured misali gnment is so severe that all marks cannot be brought into registration simu ltaneously by the usual x-y translations and rotations, the mold is deliber ately deformed with a system of piezoelectric actuators in such a way that its induced distortions precisely match those on the wafer and all of the a lignment marks at each chip site can be pulled into registration simultaneo usly. Finite-element analysis indicates that using actuators to distort the mold is superior to distorting the wafer. (C) 2000 American Vacuum Society . [S0734-211X(oo)05406-8].