A novel alignment system for imprint lithography in the deep sub-hundred na
nometer realm is proposed. The new system is inherently more precise than t
he alignment systems used in conventional projection lithography because al
ignment marks on an imprint mold (the functional equivalent of a photomask
in projection lithography) are directly compared to alignment marks on a wa
fer with no intermediate optics or reference points. If the measured misali
gnment is so severe that all marks cannot be brought into registration simu
ltaneously by the usual x-y translations and rotations, the mold is deliber
ately deformed with a system of piezoelectric actuators in such a way that
its induced distortions precisely match those on the wafer and all of the a
lignment marks at each chip site can be pulled into registration simultaneo
usly. Finite-element analysis indicates that using actuators to distort the
mold is superior to distorting the wafer. (C) 2000 American Vacuum Society
. [S0734-211X(oo)05406-8].