S. Moffatt et al., Silicon damage studies due to ultra-low-energy ion implantation with heavyspecies and rapid thermal annealing, MAT SC S PR, 3(4), 2000, pp. 291-296
There have been many studies of electron volt implants of B+ into silicon.
This focus on boron was due to enhanced diffusion phenomena and the particu
lar difficulty in constructing high conductivity, very shallow layers with
B+ light ion. We have also analysed some features of high-dose implantation
of As+ to form n(+) layers with shallow junction depths (30-40 nm) with ca
rrier concentration of > IE20 cm(-3). Some of our heavy ion work is present
ed here. We characterised the surface damage region (SDR) and identified se
veral non-linear phenomena. High-conductivity layers of 150-300 Omega /squa
re can be made with rapid thermal annealing, The critical limiting factors
are range shortening, sputtering and out-diffusion, The range shortening is
evident in the saturation behaviour and the out-diffusion is seen as a bui
ld up of non-substitutional arsenic in the oxide or the oxide-silicon inter
face after annealing. We have used Rutherford backscattering (RBS), medium-
energy ion scattering (MEIS) and high-resolution transmission electron micr
oscopy (HRTEM) to study crystal micro-structure and damage, as well as seco
ndary ion mass spectrometry (SIMS), spreading resistance profiling (SRP) an
d sheet resistance methods to study both the diffusion and activation of th
e dopant. We have observed new features in the diffusion profile with vario
us implant temperatures and offer some explanations for this behaviour. We
have also studied Sb+ and In+ implants because they are becoming increasing
ly important, at moderate energies, for hyper-abrupt channel and channel en
gineering with controlled lateral diffusion. Models have been developed to
describe the non-linear behaviour of heavy ion doping at low energies and o
ur results demonstrate that implants in the energy range 300 eV-2.5 keV can
provide solutions when combined with short rapid thermal anneals for the m
anufacture of very shallow junctions with high activation of dopant. Intere
stingly, implants at room temperature do not produce the best results. (C)
2000 Elsevier Science Ltd. All rights reserved.