Prediction of the morphology of the as-implanted damage in silicon using anovel combination of BCA and MD simulations

Authors
Citation
M. Posselt, Prediction of the morphology of the as-implanted damage in silicon using anovel combination of BCA and MD simulations, MAT SC S PR, 3(4), 2000, pp. 317-323
Citations number
7
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
ISSN journal
13698001 → ACNP
Volume
3
Issue
4
Year of publication
2000
Pages
317 - 323
Database
ISI
SICI code
1369-8001(200008)3:4<317:POTMOT>2.0.ZU;2-J
Abstract
In order to predict type and amount of defects created by keV ions under re alistic implantation conditions, a combination of computer simulations base d on the binary collision approximation (BCA) with classical molecular dyna mics (MD) calculations is proposed. Time-ordered BCA simulations are applie d to ballistic processes with characteristic energies above several 10 eV. Athermal, rapid thermal, and thermally activated processes with lower chara cteristic energies are treated by MD simulations. They yield the as-implant ed defect state formed several 10 ps after ion impact. The MD calculations are performed in cells which are much smaller than the entire volume of the collision cascade of an incident ion but much larger than the distance bet ween nearest-neighbor atoms in the lattice. The as-implanted damage produce d by a single ion in a certain cell is found to be completely determined by the nuclear energy deposition of the ion into the cell. Therefore, the MD calculations need to be performed only in one cell for different values of nuclear energy deposition, and statistical considerations based on BCA simu lations can be employed to obtain the depth profile and the total number of different defect species (vacancies, interstitials, disordered atoms, etc. ) created on average per incident ion. The novel simulation method is appli ed to investigate the damage morphology produced by 15 keV B+, 30 keV P+, a nd 15 keV As+ implants. (C) 2000 Elsevier Science Ltd. All rights reserved.