a-C : H films deposited on crystalline silicon to masking it anisotropic etching by aqueous ethylenediamine solution

Citation
A. Fissore et al., a-C : H films deposited on crystalline silicon to masking it anisotropic etching by aqueous ethylenediamine solution, MICROELEC J, 32(1), 2001, pp. 49-51
Citations number
10
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS JOURNAL
ISSN journal
00262692 → ACNP
Volume
32
Issue
1
Year of publication
2001
Pages
49 - 51
Database
ISI
SICI code
0026-2692(200101)32:1<49:A:HFDO>2.0.ZU;2-6
Abstract
Amorphous hydrogenated carbon (a-C:H) thin films deposited by r.f. chemical vapor deposition were applied as mask to anisotropic etching of crystallin e silicon by aqueous solution of Ethylenediamine with Pyrocatechol (EDP). F ilms with thicknesses of approximately 100 nm were successfully patterned o n silicon slices by the Lift-off process. Then the masked samples were subm itted to one aqueous EDP solution during time intervals of 8, 16, 24 and 10 0 min at a temperature of 98 degreesC, The inspection showed well defined e tching pattern and absence of etch pits on the surface underneath the film indicating the high chemical resistance of the a-C:H film to the aqueous ED P solution. (C) 2000 Elsevier Science Ltd. All rights reserved.