Gas cluster ion beam (GCIB) processing has recently been introduced as a co
mmercial tool for processing 'rough' surfaces, such as polished substrates
or thin films. The physical interaction of a gas cluster ion beam with a su
rface is strikingly different from that of better-known 'monomer' ion beams
. Clusters are formed by the adiabatic expansion of gas through a nozzle, i
onization by electron impact, acceleration, and then impingement upon the s
urface to be processed. The physics of the surface interaction of the clust
er beam strongly depends upon gas composition, cluster size, cluster size d
istribution, and beam energy. Typical argon GCIBs are composed of clusters
ranging from several hundred to several thousand atoms in size. It has been
previously shown that Ar clusters can be used to smooth surfaces at a sub-
nanometer level. Argon cluster beam smoothing typically occurs in the energ
y range between 15 and similar to 30 keV. As such, the average energy per a
tom is of the order of 10 eV/atom upon cluster impact with the surface and
subsequent dissociation. Ion cluster beams formed with reactive gases such
as oxygen and nitrogen can also be formed, but at somewhat lower current de
nsities than those obtainable with argon. Upon impact, reactive gas cluster
s undergo strong chemical reactions at the substrate surface. An extension
of this chemical interaction is to utilize reactive clusters in an ion beam
-assisted, thin-film physical vapor deposition process. This has been demon
strated with relatively low energy (E < <similar to> 10 keV) oxygen cluster
s in an electron-beam evaporator to form extremely low resistivity indium-t
in oxide films on room-temperature substrates. This paper will describe the
basics of GCIB formation and application to atomic scale smoothing of tech
nologically interesting substrates and thin films, as well as reactive GCIB
assisted deposition technology. The results presented demonstrate some of
the unique physics and materials science that can be achieved with an emerg
ing GCIB technology. (C) 2000 Published by Elsevier Science B.V. All rights
reserved.