A comprehensive study of different fundamental aspects of light emission fr
om defects in Si semiconductor devices is presented. Based on an experiment
al analysis, using a new highly sensitive spectroscopic photon emission mic
roscope (SPEM) for continuous wavelength analysis (2.5 eV-1.2 eV), a unique
assignment of the spectrum of the emitted light and the corresponding fail
ure mechanism is established. Three distinguishable basic spectral categori
es were identified. They were attributed to gate oxide breakdown, metal sho
rts, and electro-static discharge caused junction spiking. The focused ion
beam technique was used to look at the damage sites for confirmation of the
SPEM results. (C) 2001 American Institute of Physics.