Osmium-metal coating device using hollow-cathode plasma CVD method

Citation
H. Akahori et al., Osmium-metal coating device using hollow-cathode plasma CVD method, J ELEC MICR, 49(6), 2000, pp. 735-744
Citations number
7
Categorie Soggetti
Multidisciplinary
Journal title
JOURNAL OF ELECTRON MICROSCOPY
ISSN journal
00220744 → ACNP
Volume
49
Issue
6
Year of publication
2000
Pages
735 - 744
Database
ISI
SICI code
0022-0744(2000)49:6<735:OCDUHP>2.0.ZU;2-P
Abstract
A novel osmium-metal coating device for SEM observation has been developed to prevent negative charge build-up on specimens by applying the hollow-cat hode low voltage discharge plasma chemical vapour deposition (CVD) method. The CVD method using the hollow-cathode offers the following advantages. (i ) The method can deposit osmium-metal at very low discharge voltage that is as low as half of that of the planar parallel electrode method. Therefore, the method avoids damage due to ion bombardment during the coating process . (ii) The method can minimize the quantity of the OsO4 gas by introducing directly into the hollow-cathode. This feature is important to prevent the air pollution caused by the purged gas. (iii) A large coating area is guara nteed because the Os ion is filled in the hollow-cathode where the specimen is holed. (iv) The lower discharge voltage can be used by mixing Ar, N-2 o r air with the OsO4 gas as the environmental gas in the chamber. (v) The hy brid coating is also available by lining the appropriate metal material suc h as platinum (Pt) on the surface of the inside of the hollow-cathode. The method uses the plasma CVD of Os metal as well as the ion-sputter depositio n of the lined metal.