Flow behaviour of thin polymer films used for hot embossing lithography

Citation
Lj. Heyderman et al., Flow behaviour of thin polymer films used for hot embossing lithography, MICROEL ENG, 54(3-4), 2000, pp. 229-245
Citations number
20
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONIC ENGINEERING
ISSN journal
01679317 → ACNP
Volume
54
Issue
3-4
Year of publication
2000
Pages
229 - 245
Database
ISI
SICI code
0167-9317(200012)54:3-4<229:FBOTPF>2.0.ZU;2-D
Abstract
The viscous flow of thin PMMA films into microcavities during hot embossing has been investigated in order to optimise the moulding process for nanost ructured surfaces. The fastest embossing times were obtained at temperature s > 100 degreesC above T-g with viscosities in the range 300 to 3000 Pa s. Two fill mechanisms have been observed: simple how of the PMMA from the bor ders and formation of polymer mounds. A simple theory was used to estimate the embossing time required to fill a given stamp geometry. Thin polymer ri dges with aspect ratios up to 6:1 were moulded and plastic deformation duri ng demoulding was observed. (C) 2000 Elsevier Science B.V. All rights reser ved.