Investigation of asymmetrical coupled microstrip lines with finite metallization thickness

Authors
Yun, NI Hong, IP Park, HK
Citation
Ni. Yun et al., Investigation of asymmetrical coupled microstrip lines with finite metallization thickness, MICROW OPT, 28(1), 2001, pp. 45-47
Citations number
6
Categorie Soggetti
Optics & Acoustics
Journal title
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS
ISSN journal
08952477 → ACNP
Volume
28
Issue
1
Year of publication
2001
Pages
45 - 47
Database
ISI
SICI code
0895-2477(20010105)28:1<45:IOACML>2.0.ZU;2-Y
Abstract
In this letter, asymmetrical coupled microstrip lines with finite metalliza tion thickness are proposed and investigated by the mode-matching method. T he numerical results show that the metallization thickness affects thr prop agation characteristics, and can be a new parameter in the asymmetrical cou pled microstrip, lines, which enables us to design more accurate properties of monolithic microwave integrated circuits (MMICs). (C) 2001 John Wiley & Sons, Inc.