Deposition of well adhering cBN films up to 2 mu m thickness by B-C-N gradient layer system

Citation
K. Yamamoto et al., Deposition of well adhering cBN films up to 2 mu m thickness by B-C-N gradient layer system, THIN SOL FI, 377, 2000, pp. 331-339
Citations number
31
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
377
Year of publication
2000
Pages
331 - 339
Database
ISI
SICI code
0040-6090(200012)377:<331:DOWACF>2.0.ZU;2-A
Abstract
Deposition of cBN films was carried out in a R.F. diode sputtering apparatu s with an auxiliary magnetic field using a boron carbide (B4C) target. Adhe sion of the cBN films was vastly improved by a compositional gradient layer which contains B, C and N. By employing this interlayer, the deposition of thick (up to similar to 2 mum) and stable cBN films were enabled. The SIMS depth profile measurements revealed that the gradient layer system started with a boron carbide layer, which is the first layer on the substrate, and had a composition approximately that of B,C. At the interface between the B,C and the cBN layer, a step-like or continuous increase of N was clearly visible while B and C decreased, respectively. From the IR spectra of each gradient layer step, the B-C bonding was observed for the B,C layer and was gradually replaced by sp(2) B-N as the N concentration was increased. The gradient layer system exhibited relatively high plastic hardnesses ranging from 24 to 30 GPa. The IR spectra of thick firms showed that these films co ntain a high amount of cBN phase. The X-ray diffraction confirmed that the film was predominately cBN and was [110] textured. The hardness measurement s carried out by nano-indentation showed that these cBN layers have a hardn ess of up to 60 GPa. The surface morphology was observed by AFM and the sur face roughness increased with increasing coating thickness. Based on the re sults of structural and mechanical property analysis, a primary mechanism f or adhesion improvement will be proposed. (C) 2000 Elsevier Science B.V. Al l rights reserved.