Al-coatings of approximately 50 nm thickness were deposited by thermal evap
oration on Si(100)-wafers. The changes of the Al-films during oxygen plasma
treatment in a 2.45-GHz microwave discharge at a pressure of 0.1 Pa were i
nvestigated. To study the oxidation kinetics the formed aluminium oxide was
investigated using grazing incidence X-ray reflectometry (GIXR), XPS and I
R and the residual Al layers were studied using grazing incidence X-ray dif
fractometry (GIXRD). It was observed that oxygen plasma treatment lead to r
eactions at low temperatures (< 300<degrees>C) where thermal treatment show
no noticeable effect. The developed oxide is X-ray amorphous. To quantify
the alumina formation the change of the film thickness and of the Al(111) p
eak integral intensity of the non-reacted part of aluminium were determined
time-controlled. From these results it can be concluded that two processes
, an oxidation and a sputtering process, influence the oxide film growth. T
he crystallization behaviour was investigated by means of in situ GIXRD dur
ing post-annealing in dependence on different plasma treatments. (C) 2000 E
lsevier Science B.V. All rights reserved.