Development of a low-dielectric-constant polymer for the fabrication of integrated circuit interconnect

For faster, smaller, and higher performance integrated circuits, a low diel ectric constant insulator is required to replace silicon dioxide. Here the properties of a new dielectric-SiLK resin, a solution of a low-molecular-we ight aromatic thermosetting polymer-are reviewed and examples of its applic ation in the fabrication of interconnect structures, such as the one shown in the Figure, are given.