APPLICATION OF ELECTRON-BEAM LITHOGRAPHY TO STUDY MICROCREEP DEFORMATION AND GRAIN-BOUNDARY SLIDING

Electron beam lithography has been employed to study microcreep deform ation and grain boundary sliding in pure copper. Fine electron-sensiti ve microgrids of an alloy of palladium and gold were developed on the surface of rectangular specimens. Interrupted creep tests were carried out at 723 K at two stress levels in an argon atmosphere. Creep strai n and grain boundary sliding were determined by forming Moire fringes in a scanning electron microscope as well as from the displacement of the grid lines. Local distribution of creep strain inside the grains w as found to be non-uniform. Grain boundary sliding exhibited a wavy be haviour.