S. Kishimoto et al., APPLICATION OF ELECTRON-BEAM LITHOGRAPHY TO STUDY MICROCREEP DEFORMATION AND GRAIN-BOUNDARY SLIDING, Journal of Materials Science, 32(13), 1997, pp. 3411-3417
Electron beam lithography has been employed to study microcreep deform
ation and grain boundary sliding in pure copper. Fine electron-sensiti
ve microgrids of an alloy of palladium and gold were developed on the
surface of rectangular specimens. Interrupted creep tests were carried
out at 723 K at two stress levels in an argon atmosphere. Creep strai
n and grain boundary sliding were determined by forming Moire fringes
in a scanning electron microscope as well as from the displacement of
the grid lines. Local distribution of creep strain inside the grains w
as found to be non-uniform. Grain boundary sliding exhibited a wavy be
haviour.