Jd. Lee et al., Silicide application on gated single-crystal, polycrystalline and amorphous silicon FEAs - Part I: Mo silicide, IEEE DEVICE, 48(1), 2001, pp. 149-154
In order to improve both the level and the stability of electron field emis
sion, the tip surface of silicon field emitters have been coated with a mol
ybdenum layer of thickness 25 nln through the gate opening and annealed rap
idly at 1000 degreesC in inert gas ambient, The gate voltages of single-cry
stal silicon (c-Si), polycrystalline silicon (poly-Si) and amorphous silico
n (a-Si) field emitter arrays (FEAs) required to obtain anode current of 10
nA per tip are 90 V, 69 V, and 84 V, respectively. In the case of the sili
cide emitters based on c-Si, poly-Si and a-Si, these gate voltages are 76 V
, 63 V, and 69 V, respectively. Compared with c-Si, poly-Si and a-Si field
emitters, the application of Mo silicide on the same silicon field emitters
exhibited 9.6 times, 2.1 times, and 4.2 times higher maximum emission curr
ent, and 6.1 times, 3.7 times, and 3.1 times lower current fluctuation, res
pectively. Moreover, the emission currents of the silicide FEAs depending o
n vacuum level are almost same in the range of 10(-9) similar to 10(-6) tor
r. This result shows that silicide is robust in terms of anode current degr
adation due to the absorption of air molecules.