Silicide application on gated single-crystal, polycrystalline and amorphous silicon FEAs - Part II: Co silicide

Citation
Jd. Lee et al., Silicide application on gated single-crystal, polycrystalline and amorphous silicon FEAs - Part II: Co silicide, IEEE DEVICE, 48(1), 2001, pp. 155-160
Citations number
23
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON ELECTRON DEVICES
ISSN journal
00189383 → ACNP
Volume
48
Issue
1
Year of publication
2001
Pages
155 - 160
Database
ISI
SICI code
0018-9383(200101)48:1<155:SAOGSP>2.0.ZU;2-X
Abstract
For enhancement and stabilization of electron emission, Co silicides were f ormed from Co, Co/Ti and Ti/Co layers on silicon FEAs, Since Ti prevents ox ygen adsorption on the Co film during silicidation, uniform and smooth Co s ilicide layers can be obtained by depositing Co first and then Ti on silico n tips, followed by rapid annealing, Among Co silicide FEAs, Co silicide fo rmed from Ti/Co bi-layers shows the lowest leakage current, the highest fai lure voltage over 152 V and the largest anode current over 1 mA at the gate voltage of 150 V, Compared with silicon field emitters, the silicide FEAs formed from Ti/Co layers exhibited a significant improvement in maximum emi ssion current, emission current fluctuation and stability, and failure volt age.