The effects of accumulated radiation damage which arise from the excessive
current density employed during focused ion beam implantation are described
. The dwell time during beam scanning significantly influences the focused
ion beam synthesis of CoSi2 in Si. At sufficiently low accumulated damage,
single-crystalline CoSi2 layers are obtained, similarly to conventional ion
implantation. A procedure is described which enables the reduction of radi
ation damage induced by a focused ion beam to the level of conventional ion
implantation. This is of importance for the formation of single-crystallin
e CoSi2 layers.