On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications

Authors
Yan, J Yoshino, M Kuriagawa, T Shirakashi, T Syoji, K Komanduri, R
Citation
J. Yan et al., On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications, MAT SCI E A, 297(1-2), 2001, pp. 230-234
Citations number
17
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN journal
09215093 → ACNP
Volume
297
Issue
1-2
Year of publication
2001
Pages
230 - 234
Database
ISI
SICI code
0921-5093(20010115)297:1-2<230:OTDMOS>2.0.ZU;2-0
Abstract
The role of hydrostatic pressure in the ductile machining of silicon is dem onstrated experimentally using a single crystal diamond tool with a large n egative rake (-40 degrees) and a high side cutting edge angle (SCEA) (simil ar to 88 degrees) and undeformed chip thickness in the nanometric range (si milar to 50 nm) using an ultraprecision machine tool and a special machinin g stage inside a high external hydrostatic pressure (similar to 400 MPa) ap paratus. (C) 2001 Elsevier Science B.V. All rights reserved.