Inplane and antiplane T-stresses for an interface crack in anisotropic bimaterial

Citation
Jh. Kim et al., Inplane and antiplane T-stresses for an interface crack in anisotropic bimaterial, MECH MATER, 33(1), 2001, pp. 21-32
Citations number
15
Categorie Soggetti
Material Science & Engineering
Journal title
MECHANICS OF MATERIALS
ISSN journal
01676636 → ACNP
Volume
33
Issue
1
Year of publication
2001
Pages
21 - 32
Database
ISI
SICI code
0167-6636(200101)33:1<21:IAATFA>2.0.ZU;2-V
Abstract
To evaluate the inplane and antiplane T-stresses easily by a suitable appli cation of the conservation integral without solving the boundary value prob lem, the relation between the J-based mutual integral and the T-stresses is derived explicitly for anisotropic bimaterial subject to inplane and antip lane loading. The universal relation between the T-stresses of the specimen s with and without a sandwiched layer is also derived and it holds true reg ardless of the specimen size and loading condition if the layer thickness i s sufficiently small. In order to show its usefulness, some basic problems for interface crack including the interaction of an interface crack and a p oint singularity are solved. In particular, a detailed computation is illus trated for antiplane T-stress, in which the inplane and antiplane deformati ons are decoupled. (C) 2001 Elsevier Science Ltd. All rights reserved.