A new all-silicon multichip module with integrated thermal management syste
m is presented. Our new packaging approach combines the benefits of wafer-s
cale integration with the flexibility of independently fabricated and pre-t
ested devices, allowing the development of highly integrated systems. Wet a
nisotropic etching is used for the dicing of silicon integrated circuits as
well as for the fabrication of the chip-receiving cavities in the silicon
substrate. The etching exposes {1 1 1} type planes in both chip and receivi
ng surface, assuring a virtually perfect mating of the assemblage. The syst
em is complemented with an integrated silicon heat sink, which can maintain
heat fluxes in excess of 100 W/cm(2).