Development toward an all-silicon integrated thermal management system: the integrated MCM

A new all-silicon multichip module with integrated thermal management syste m is presented. Our new packaging approach combines the benefits of wafer-s cale integration with the flexibility of independently fabricated and pre-t ested devices, allowing the development of highly integrated systems. Wet a nisotropic etching is used for the dicing of silicon integrated circuits as well as for the fabrication of the chip-receiving cavities in the silicon substrate. The etching exposes {1 1 1} type planes in both chip and receivi ng surface, assuring a virtually perfect mating of the assemblage. The syst em is complemented with an integrated silicon heat sink, which can maintain heat fluxes in excess of 100 W/cm(2).