Kinetic mechanism of surface instability evolution during etching, corrosion, and growth of elastically stressed solids

Citation
Yg. Shreter et al., Kinetic mechanism of surface instability evolution during etching, corrosion, and growth of elastically stressed solids, PHYS SOL ST, 43(1), 2001, pp. 169-175
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
PHYSICS OF THE SOLID STATE
ISSN journal
10637834 → ACNP
Volume
43
Issue
1
Year of publication
2001
Pages
169 - 175
Database
ISI
SICI code
1063-7834(2001)43:1<169:KMOSIE>2.0.ZU;2-0
Abstract
Corrosion precursors in the form of microgrooves appearing on the elastical ly compressed surface of a silicon plate under etching are investigated. No corrosion precursors are observed on the elastically stretched surface. Th is distinguishes the observed effect from corrosion cracking of metals, dur ing which corrosion usually takes place on stretched surfaces. The general dynamic model proposed for the evolution of surface microgrooves during etc hing, corrosion, and growth of elastically stressed solids is based on the concept of two local etching (growth) rates which are linear functions of t he local stress tensor. The model describes the kinetics of the process, an d the asymmetry of corrosion evolution to the deformation sign. The role of stacking faults, dislocations, and artificially created surface steps in t he evolution of corrosion in stressed silicon crystals is studied. (C) 2001 MAIK "Nauka/Interperiodica".